Overview

PCB Solder Pallet Material Selector ,Polyimide resin matrix composite.

CDM materials have superior mechanical properties and dimensional stability at elevated temperatures, such as those used in the lead-free soldering process. The material was developed to allow solder pallet designers create the best solutions for the PCB assembly industry.

CDM stone is a high quality solder pallet material that enables good pallet design providing the best possible results from  the wave soldering process.
The lifespan of solder pallets depends on many factors including material choice, pallet design and process conditions.

Standard Sizes

Details

• Excellent mechanical properties at elevated temperatures including the lead-free process.
• Low thermal conductivity.
• Excellent machining properties enabling the manufacture of complex design solder pallets.
• Good resistance to chemicals used in modern fluxes.

CDM IS WIDELY USED FOR:

• PCB assembly process.
• suitable for use in the SMT reflow and wave soldering processes,

FRP Materials Options:

Dostone 3B3-0 is a laminate consisting of E-glass cloth, graphite and epoxy-resin.

Dostone 3B3-2 has excellent mechanical properties even at high temperature and shows conductivity parallel and perpendicular to layers as necessary for ESD application. The special epoxy resin used as well as the smooth unsanded surface result in high chemical and temperature resistance.

COMMON BRANDS:

• DOTOQ