Meldin® 7001 Unfilled Polyimide Parts and Shapes.

Meldin 7001 Rods & Plates offer superior mechanical properties & high chemical resistance.

Meldin is ideal for electrical and thermal insulating applications. More ductile than ceramics, and lighter weight than metals,

Meldin® 7001 is an excellent choice for structural parts in aerospace and other applications where metal replacement is desirable.

In Semiconductor Wafer Processing applications, the plasma etch rate of Meldin® 7001 is 10% to 20% lower than Vespel® SP-1 providing superior performance over time. (contact us for complete details).

For IC Test Sockets & Probe Test Heads, Meldin® 7001 is also an excellent replacement for Vespel® SP-1.

Meldin 7000 products feature Continuous Operational Temperatures up to 550ºF (260ºC) and Intermitting Operation up to 900ºF , while holding tight tolerances of ±0.001 in. on both ODs and IDs.

Meldin 7001 is suitable for high-temperature structural, high-purity semiconductor, & plasma welding applications.

Meldin Plates are Compression Molded & Meldin Rods are Isostatically Molded (ISO).

Meldin DF Parts are Direct Formed. (contact us for custom quotes).

>DuPont™ Vespel® SP-1 unfilled offers superior wear and insulation properties with operating temperatures from cryogenic to 260°C (500°F).

>PI (Aromatic Polyimide) Excellent abrasion resistance in particular to sliding abrasion under high temperatures makes the material a standout among other super engineering plastic.

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Our experienced sales and technical teams are available to assist you with material selection challenges.