Prelaminated inlay Combi are designed specifically with the card manufacturer in mind.
RFID inlay Combi consist of two or even more different chip technologies, offering combinations of HF + LF, HF + UHF or LF + UHF chips in one card. Even a contact chip module can be embedded if the layout is designed accordingly.

Product Description
Prelaminated rfid inlays are suitable for use in the production of ISO standard cards. RFIDHY uses a proprietary manufacturing process to produce its prelaminated rfid inlays.
Our rfid inlays are very robust and boast unequaled torsion / bending characteristics, extreme durability and optimized read / write performance. The inlays have a completely flat finish and bring numerous benefits to card manufacturers.
Our rfid inlay is essentially a semi-finished product, so that the card manufacturer merely needs to collate his printed sheets with the inlay and laminate the “sandwich”.

Features
• Very reliable and robust plastic package
• High reading distance optimized to each chip
• Materials: PVC, PETG, PC
• Colour: white or transparent
• Option of combining two different chip technologies in one prelam
• Different sheet formats are available 1 × 5, 2 × 5, 3 × 6, 3 × 7, 3 × 8, 3 × 10, 4 × 10 up to 640 × 520 mm, others upon request
• Thickness: LF+HF(0.6mm), LF+UHF(0.55~0.6mm), HF+UHF(0.5mm)

Features Examples of application
• Physical access
• Logical access
• Public transport
• City card
• Student card
• E-purse systems

Available chip technologies

Manufacturer/Frequency	125 kHz	13.56 MHz	860-960Mhz
EM Microelectronic	EM4102, EM4200, EM4305, EM4450
NXP	Hitag®1, 2, S	MIFARE Ultralight®, MIFARE® Classic, MIFARE® DESFire®, MIFARE Plus®, I-Code®: SLI
Infineon		MIFARE®: SLE66R35
Atmel	ATA5575M1, ATA5575M2, ATA5577, Q5
Legic®		Prime: MIM256, MIM1024
Impinj			Monza 4, Monza 5
Alien			Alien H3, H4

Other ICs are available upon request.

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