DOSTONE^TM special grades have also been developed for the PCB assembly industry for use as carriers in the wave solder and SMT processes  including lead free soldering. The 3B3 grades are also suitable for top plates and other jigs and fixtures used in the PCB assembly industry.

PERFORMANCE CHARACTERISTICS:

· The heavy-duty glass fibre reinforced plastic
· strength and excellent electrical,
· thermal and chemical properties.
· The low thermal conductivity of the materials prevents heat sinking from the PCB, ensuring adequate reflow of the solder paste.

Note:DOSTONE^TM is made in Suzhou Dotoq Materials Technology in China.

> Ceramic Thermal Insulation Materials

>Standard: DOTOQ stone 3B3-1

Not sure what your options are? please contact us by the form below.

Our experienced sales and technical teams are available to assist you with material selection challenges.